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Ultrasonic Cleaning Systems for
ELECTRONICS ASSEMBLY
Guyson's Kerry ultrasonic cleaning systems for the electronics industry handle applications ranging from low volume defluxing of printed circuit boards, through maintenance cleaning of assembly equipment and stencil cleaning, to high throughput defluxing of PCB's for aerospace or defence sectors. Cleaning can be carried out with dual frequency ultrasonics or without sonics if required.
Our guide starts with high volume cleaning. Please scroll down or if you prefer go straight to low volume and maintenance cleaning.
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For help or advice on your particular electronics cleaning requirement, please call us on +44 (0)1756 799911 or email info@guyson.co.uk, quoting Electronics Webpage and including your company name, address and telephone number.
HIGH THROUGHPUT /
HIGH SPECIFICATION
ULTRASONIC CLEANING |
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Strongly recommended, proven process |
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Process recommended subject to trials |
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Subsidiary application |
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| CLEANING APPLICATION |
Microclean
4-stage
systems |
Microsolve
Mono-solvent
systems |
Microsolve
Co-solvent
systems |
SC1000
stencil
cleaner |
| SMT stencils |
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| Misprinted PCBs - paste removal |
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| Reworked PCBs - flux removal |
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| PCBs, bare |
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| PCBs, partially populated - flux removal |
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| PCBs, assembled - flux removal |
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| PCBs, very high specification cleaning, eg to Mil Std |
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| PCBs, cleaning without ultrasonics |
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| Soldering jigs and fixtures - flux removal |
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HIGH THROUGHPUT ULTRASONIC CLEANING SYSTEMS
Microsolve processes: The Mono-solvent process removes flux and solder balls and strips conformal coating. Co-solvent systems deflux all types of PCBs to MIL spec standards, eliminating white residues and removing even no-clean and lead-free solder flux residues. Options includes dual-frequency ultrasonics for cleaning sensitive devices, and cleaning without ultrasonics.
Microclean 4-stage aqueous and semi-aqueous processes remove flux residues including rosin fluxes, and strip conformal coating; an optional deionised rinse provides ionic cleanliness to higher than MIL spec levels.
The Microclean SC1000 stencil and misprinted PCB cleaner removes solder paste and adhesives, meeting the demanding cleaning specifications of leading global PCB manufacturers.
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Microclean 4-stage aqueous system |
Microsolve 450 Co-solvent system |
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CO-SOLVENT SYSTEMS IN ACTION
BAe finds environmental care makes financial sense
At BAe Land Platform Communications a Co-solvent cleaning system removes
no-clean flux residue without ultrasonics where required.
The system has saved BAe
£7,000 pa in solvent costs.
Co-solvent system replaces 141b
Electronic Technicians (ETL), which assembles PCBs for the aerospace and general electronics industries, has seen an improvement in cleaning quality and a reduction in reject rates with a Co-solvent cleaning system.
Co-solvent system completely eliminates rejects
At Gai-Tronics a Co-solvent system cleans circuit boards for ruggedised telephones prior to conformal coating, removing all traces of no-clean fluxes and associated white residues.
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LOW THROUGHPUT PCB CLEANING
AND MAINTENANCE CLEANING |
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Strongly recommended, proven process |
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Process recommended subject to trials |
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Subsidiary application |
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| CLEANING APPLICATION |
MKC
bath |
KS
tank |
UCR
2-stage |
CRD
3-stage |
Stencil
cleaner |
| SMT stencils |
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| Misprinted PCBs - paste removal |
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| Reworked PCBs - flux removal |
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| PCBs, bare |
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| PCBs, partially populated - flux removal |
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| PCBs, assembled - flux removal |
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| Soldering jigs and fixtures - flux removal |
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| Maintenance cleaning |
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| Placement / dispensing nozzles |
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| Print heads |
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| Chains and squeegees |
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| Reflow machine heat exchangers, cooling radiators |
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| Feeder mechanisms for placement machines |
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If you have any questions about ultrasonics, why not view our Ultrasonic FAQ page? Here you will find some of the most common questions we are asked - and the answers.
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